Settlement builds on current collaboration between the 2 corporations for the joint improvement of 2nm node know-how
TOKYO, June 3, 2024 /PRNewswire/ — Rapidus Company, a producer of superior logic semiconductors, and multinational know-how firm IBM (NYSE: NYSE:), at the moment introduced a joint improvement partnership aimed toward establishing mass manufacturing applied sciences for chiplet packages. Via this settlement, Rapidus will obtain packaging know-how from IBM for high-performance semiconductors, and the 2 corporations will collaborate with a objective of additional innovating on this area.
This settlement is a part of a world collaboration inside the framework of the “Improvement of Chiplet and Bundle Design and Manufacturing Expertise for 2nm-Technology Semiconductors” mission being performed by Japan’s New Vitality and Industrial Expertise Improvement Group (NEDO) and builds on an current settlement with IBM for the joint improvement of 2nm node know-how. As a part of the settlement, IBM and Rapidus engineers will work in collaboration at IBM’s services in North America for R&D and manufacturing of semiconductor packaging for high-performance pc methods.
Through the years, IBM has accrued R&D and manufacturing applied sciences for semiconductor packaging for high-performance pc methods. The corporate additionally has a wealth of expertise with joint improvement partnerships with Japanese semiconductor producers, in addition to producers of semiconductors, bundle manufacturing tools, and supplies. Rapidus goals to leverage this experience to rapidly set up cutting-edge chiplet packaging know-how.
Rapidus President and CEO Dr. Atsuyoshi Koike commented: “Constructing on our present joint improvement settlement for 2nm semiconductor know-how, we’re extraordinarily happy to formally announce at the moment this partnership with IBM to determine chiplet packaging know-how. We’ll profit from this worldwide collaboration and pursue initiatives that can enable Japan to play an much more necessary function within the semiconductor packaging provide chain.”
DarÃo Gil, SVP and Director of Analysis at IBM, stated: “With many years of innovation in superior packaging, IBM is honored to develop our collaboration with Rapidus to develop state-of-the-art chiplet know-how. Via our settlement, we’re dedicated to supporting the event of probably the most superior node manufacturing processes, design, and packaging, in addition to creating new use circumstances and supporting the semiconductor workforce.”
About IBMIBM is a number one supplier of world hybrid cloud and AI, and consulting experience. We assist shoppers in additional than 175 international locations capitalize on insights from their knowledge, streamline enterprise processes, cut back prices and achieve the aggressive edge of their industries. Greater than 4,000 authorities and company entities in crucial infrastructure areas similar to monetary providers, telecommunications and healthcare depend on IBM’s hybrid cloud platform and Pink Hat OpenShift to have an effect on their digital transformations rapidly, effectively and securely. IBM’s breakthrough improvements in AI, quantum computing, industry-specific cloud options and consulting ship open and versatile choices to our shoppers. All of that is backed by IBM’s legendary dedication to belief, transparency, duty, inclusivity and repair. Go to ibm.com for extra info.
About RapidusRapidus Company goals to develop and manufacture the world’s most superior logic semiconductors. By creating and offering providers to shorten cycle instances for design, wafer processes, 3D packaging, and different points of semiconductor manufacturing, Rapidus creates new industries along with prospects. We proceed to embrace challenges that contribute to the success, prosperity, and happiness of individuals’s lives utilizing semiconductors.
Media contacts:
Kreab Okay.Okay. (Japan)Kunihiko Yasue, KreabE-mail: kyasue@kreab.com
Takano Okumoto, KreabE-mail: tokumoto@kreab.com
Miki Yagi, KreabE-mail: myagi@kreab.com
Breakaway Communications (U.S.)Devan Gillick, rapidus@breakawaycom.com
